The manufacturing process behind semiconductor chips involves several steps, including design, fabrication, and packaging. Initially, circuit designs are created using electronic design automation (EDA) tools. Then, silicon wafers are produced, with layered materials added through photolithography, doping, and etching. Each layer forms different electronic components such as transistors and capacitors, which are essential to a chip's function. Finally, completed chips are tested for performance and packaged for integration into devices. This intricate process requires precision and advanced technology to ensure high efficiency and functionality.